As first reported by kjzz.org, Amkor Technology Inc. announced on September 10, 2026, that it will expand its semiconductor packaging and test facility in north Peoria, Arizona. The Tempe-based company increased the total projected investment for the site to $12 billion, up from the $2 billion initially announced in 2023.
What it means
The expansion will grow the facility to more than one million square feet, nearly tripling its previously planned size. Amkor said Apple is designated as the first customer for the plant. The company will package chips manufactured by TSMC for integration into electronic devices. This move supports broader efforts to onshore advanced manufacturing, which has historically been concentrated overseas.
TSMC plans to invest billions of dollars in expanding semiconductor manufacturing capacity in Arizona. Amkor’s increased spending complements other industrial developments in the state, such as Linde’s $1 billion investment in a Phoenix gas complex designed to support semiconductor production. The growth in packaging infrastructure mirrors trends seen elsewhere in the industry, including SK hynix’s recent ground-breaking for an HBM facility in Indiana.
Key facts
- New total investment: $12 billion
- Initial investment announced in 2023: $2 billion
- Facility location: North Peoria, Arizona
- Expanded facility size: Over 1 million square feet
- First designated customer: Apple
- Chip manufacturer supplying wafers: TSMC
- Process focus: Advanced packaging and testing
Source: kjzz.org, reporting an Amkor Technology Inc. announcement