The Department of Defense awarded $30 million to TTM Technologies Inc., headquartered in Santa Ana, California, on October 1, 2024, to expand domestic printed circuit board manufacturing. The award, facilitated through the Defense Production Act Purchases (DPAP) office, will fund acquisition and installation of advanced manufacturing equipment and prototype design development for printed circuit boards. Work will begin at TTM’s Centers of Excellence across the United States and culminate in integration into a new facility in Syracuse, New York.
What it means
The award will help TTM build a new facility exceeding 200,000 square feet in Syracuse, which the DoD said will increase domestic production of ultra-high density printed circuit boards. Dr. Laura Taylor-Kale, Assistant Secretary of Defense for Industrial Base Policy, said the project “provides domestic manufacturing capabilities to meet demand for current and future U.S. systems.” Anthony Di Stasio, Director of the Manufacturing Capability Expansion and Investment Prioritization (MCEIP) directorate, said the investment will bolster supply chain resilience in line with the 2024 National Defense Industrial Strategy.
The TTM award was the 70th issued by the DPAP program in Fiscal Year 2024. Total DPAP awards for the fiscal year reached $672 million across multiple areas, with the program overseen by the MCEIP directorate within the Office of the Assistant Secretary of Defense for Industrial Base Policy.
Key facts
- Award amount: $30 million to TTM Technologies Inc.
- Award date: October 1, 2024
- Funding mechanism: Defense Production Act Purchases (DPAP) office
- New facility location: Syracuse, New York
- New facility size: 200,000+ square feet (according to the company and DoD)
- Product: ultra-high density printed circuit boards
- DPAP award sequence: 70th award in Fiscal Year 2024
- Total DPAP Fiscal Year 2024 awards: $672 million
Source: Department of Defense news release (war.gov)