Solidigm is evaluating potential locations for a new NAND flash memory fabrication plant on the U.S. East Coast, with upstate New York cited as a possibility. The SK Hynix subsidiary currently produces chips at an Intel facility in Dalian, China, but U.S. export controls restrict its ability to upgrade that site with advanced technology. A spokesperson for SK Hynix said Solidigm is reviewing various options to strengthen competitiveness, though nothing has been finalized.
What it means
A domestic facility would allow Solidigm to bypass the technological limitations imposed by U.S. export restrictions on its Chinese operations. The company currently uses 192-layer 3D NAND technology at the Dalian plant, while SK Hynix utilizes more advanced 321- and 375-layer architectures at its Cheongju facility in South Korea. Establishing a U.S. fab would grant access to these latest manufacturing processes, which are currently denied to the Chinese site.
The move aligns with broader industry shifts as SK Hynix expands its American footprint. The parent company is investing approximately $4 billion (₩5.35 trillion) in an HBM packaging plant in West Lafayette, Indiana. SK Hynix Chairman Chey Tae-won stated that U.S. customers want the company to have domestic fabs. Reports also suggest SK Hynix could contract some DRAM manufacturing to Intel in the United States. An industry-wide undersupply of HBM, DRAM, and NAND chips is projected to continue until 2030.
Key facts
- Solidigm is reviewing terms for an East Coast U.S. fab, potentially in upstate New York.
- The subsidiary currently manufactures NAND chips at an Intel plant in Dalian, China.
- U.S. export restrictions prevent upgrades to latest NAND technology at the Dalian facility.
- Solidigm uses 192-layer 3D NAND; SK Hynix uses 321 and 375 layers.
- SK Hynix is investing $4 billion in an HBM packaging plant in West Lafayette, Indiana.
- SK Hynix Chairman Chey Tae-won said U.S. customers want SK Hynix to have U.S. fabs.
- An industry-wide undersupply of chips is expected to continue until 2030.
Source: Blocks & Files, reporting on Solidigm and SK Hynix developments