Gradiant announced it has secured $300 million in new contracts from semiconductor manufacturing customers since the start of 2026. The agreements cover five fabrication sites located in New York, Virginia, Idaho, and Utah. The company stated these awards include repeat business from existing clients as well as a second phase for a high-recovery wastewater facility at one of the world’s largest semiconductor fabs.
What it means
The contracts will deploy Gradiant’s full portfolio of water management systems, including ultrapure water generation, local scrubber reclaim, and zero liquid discharge technologies. The projects address complex industrial streams such as hydrofluoric-acid wastewater. According to the company, the scrubber reclaim design used in these awards has previously been proven in Singapore, Taiwan, and the United States, recovering more than 80 percent of feed volume.
Prakash Govindan, CEO of Gradiant, said water availability is a defining constraint on the speed at which chips for AI data centers and high-bandwidth memory can be produced. Nish Vora, Managing Director for Americas at Gradiant, noted that these wins provide the momentum needed to reach a target of a $1 billion U.S. order book next year. The expansion supports the growing infrastructure demands of domestic chip manufacturing, similar to recent investments in advanced lithography initiatives.
Key facts
- $300 million: value of new contracts announced since January 2026.
- Five fabrication sites involved across New York, Virginia, Idaho, and Utah.
- Systems include ultrapure water, high-recovery wastewater treatment, scrubber reclaim, and zero liquid discharge.
- Scrubber reclaim design recovers more than 80 percent of feed volume.
- One award is a second phase for a facility at a major global semiconductor fab.
- Gradiant targets a $1 billion U.S. order book in 2027.
Source: Gradiant news release