Advanced Chip and Circuit Materials, Inc. (ACCM) announced an expansion of domestic manufacturing capacity for its Celeritas advanced dielectric materials. The company plans to add 20 million square feet per year of new laminate production starting in January 2027. Prepreg and build-up material capacity will reach 87 million square feet per year by November 2026, with further expansions scheduled for the second half of 2027.
What it means
The expansion targets four AI hardware segments that ACCM identifies as constrained by material supply and performance. The new capacity supports ultra-high-speed skew-free materials, low- and negative-expansion laminates for large accelerator boards, IC substrate and package core materials, and build-up materials. All manufacturing remains within the United States, operating on a supply chain independent of conventional copper-clad laminate networks. ACCM stated that typical lead times for these materials are three weeks.
The product line includes Celeritas SF1600, an ultra-low-loss material without woven glass reinforcement designed to eliminate glass-weave skew in 224G-class switch and backplane designs. It is paired with Celeritas HM001, a near-zero-CTE, high-modulus laminate engineered for large system-on-chip and accelerator boards. Package core offerings include Celeritas HM50, which provides negative in-plane CTE for warpage control, and Celeritas SMC, which matches silicon’s coefficient of thermal expansion. The portfolio also features Celeritas BU++, an extremely low-loss build-up material compatible with standard lamination flows.
ACCM noted that none of these materials depend on T-glass or quartz fabric. They are halogen-free and PFAS-free, and they run on existing lamination, drilling, and plating equipment used by circuit board fabricators. To support this production, ACCM will open a second materials characterization laboratory in La Crosse, Wisconsin, in October 2026.
Key facts
- 20 million square feet per year: New laminate capacity volume starting January 2027
- 87 million square feet per year: Prepreg and build-up capacity by November 2026
- Second half of 2027: Scheduled time for larger expansions
- Four AI hardware segments: Target markets for the expansion
- Three weeks: Typical lead times for materials
- La Crosse, Wisconsin: Location of second materials characterization laboratory opening in October 2026
- Tarun Amla, PhD: President and CEO of ACCM
Source: Advanced Chip and Circuit Materials, Inc. news release