The Department of Commerce announced letters of intent with Helion, Commonwealth Fusion Systems, Vertical Semiconductor and Sibelco for up to $389 million in CHIPS and Science Act research and development awards. The funding covers semiconductor and materials research, including power electronics. The department will take a minority, non-controlling and non-voting equity interest in each company.
What it means
Helion could receive up to $175 million to develop U.S. high-voltage power semiconductors and advanced energy power modules. Commonwealth Fusion Systems could receive up to $85 million for semiconductors and electronics used in fusion-related applications.
Vertical Semiconductor could receive up to $73 million to advance vertical gallium nitride power semiconductors, including technology targeting a 2.5 MW super intelligence data center rack. Sibelco could receive up to $56 million for purification and finishing technology for ultra-high-purity quartz.
Key facts
- Four companies entered letters of intent with the Department of Commerce.
- The awards total up to $389 million in federal R&D funding.
- Helion’s maximum proposed award is $175 million.
- Commonwealth Fusion Systems’ maximum proposed award is $85 million.
- Vertical Semiconductor’s maximum proposed award is $73 million.
- Sibelco’s maximum proposed award is $56 million.
- Vertical Semiconductor’s targeted rack capacity is 2.5 MW.
Source: Department of Commerce announcement