FUJIFILM Corporation announced an $18 million investment to expand copper interconnect chemical mechanical planarization (CMP) slurry production at its Mesa, Arizona facility. The company will upgrade existing infrastructure to support multi-product manufacturing for advanced logic, memory, and packaging applications. Operations at the expanded line are scheduled to begin in 2027.
What it means
The expansion addresses rising demand for CMP slurries, which Fujifilm identifies as essential materials for advanced semiconductor manufacturing. The company stated that the advanced semiconductor market is entering a period of significant growth driven by rapid expansion in artificial intelligence-related demand. Major U.S. semiconductor manufacturers are currently investing in new and expanded production facilities, creating increased need for these materials.
The new Arizona facilities will serve as a bridge between product development and commercial manufacturing. Technologies from the site’s global CMP slurry research and development center will be transferred to mass production. Fujifilm holds a leading global market share for copper interconnect CMP slurries and leverages a manufacturing network across Japan, the United States, Europe, and Asia.
Key facts
- $18 million total investment amount (approximately ¥3 billion)
- Mesa, Arizona location for facility expansion
- 2027 scheduled start date for expanded production line operations
- Focus on copper interconnect CMP slurries
- Supports advanced logic, advanced memory, and advanced packaging applications
- Fujifilm holds leading global market share for copper interconnect CMP slurries
Source: FUJIFILM Corporation news release